AMD WattMan Hatası yardım

[Smuleff]

Merhabalar kendime xpg d41 ramlerden aldım 8+8 bunları taktığım günden beri sistem WattMan hatası veriyo pc kapanmıyo ama ekran gidiyo geri geliyo sonra bildirim geliyo işte sistem özelliklerim;
AsusRx5500xt 4Gb
R5 3600
Msi A320
4 adet fan
550W psu

 

[HacıSOFU]

XMP açık mı?
Thaiphoon Burner ile SS atabilir misiniz.

 

[kozroS]

youtubeda bazı wattman hataları var onları deneyebilirsin sanırım. bendede çok yaşanıyordu güncellemelerin güncel olduğuna emin olabilsen iyi olur son günlerde amd tarafında driver konusunda sıkıntılar vardı. bazı arkadaşlar benden daha bilgili olabilir onlardan tavsiye alabilirsin.

 

[Smuleff]

XMP açık mı?
Thaiphoon Burner ile SS atabilir misiniz.

evet açık

Mesaj otomatik olarak birleştirildi: 22 Mart 2023

XMP açık mı?
Thaiphoon Burner ile SS atabilir misiniz.

Manufacturing Description

Module Manufacturer:	Unknown (JEDEC ID: 7FCBh)
Module Part Number:	DDR4 3200
DRAM Manufacturer:	Micron Technology
DRAM Components:	MT40A1G16??-075:F
Component Design ID:	Not determined
DRAM Die Revision / Process Node:	F / Not determined
Module Manufacturing Date:	Week 50, 2022
Manufacturing Date Decoded:	December 12-16, 2022
Module Manufacturing Location:	Unknown: 01h
Module Serial Number:	CAE10200h
Module PCB Revision:	00h

Physical & Logical Attributes

Fundamental Memory Class:	DDR4 SDRAM
Module Speed Grade:	DDR4-2666V downbin
Base Module Type:	UDIMM (133,35 mm)
Module Capacity:	8 GB
Reference Raw Card:	C0 (8 layers)
JEDEC Raw Card Designer:	Micron Technology
Module Nominal Height:	31 < H <= 32 mm
Module Thickness Maximum, Front:	1 < T <= 2 mm
Module Thickness Maximum, Back:	T <= 1 mm
Number of DIMM Ranks:	1
Address Mapping from Edge Connector to DRAM:	Standard
DRAM Device Package:	Standard Monolithic
DRAM Device Package Type:	96-ball FBGA
DRAM Device Die Count:	Single die
Signal Loading:	Not specified
Number of Column Addresses:	10 bits
Number of Row Addresses:	17 bits
Number of Bank Addresses:	2 bits (4 banks)
Bank Group Addressing:	1 bits (2 groups)
DRAM Device Width:	16 bits
Programmed DRAM Density:	16 Gb
Calculated DRAM Density:	16 Gb
Number of DRAM components:	4
DRAM Page Size:	2 KB
Primary Memory Bus Width:	64 bits
Memory Bus Width Extension:	0 bits
DRAM Post Package Repair:	Supported
Soft Post Package Repair:	Supported

DRAM Timing Parameters

Fine Timebase:	0,001 ns
Medium Timebase:	0,125 ns
CAS Latencies Supported:	10T, 11T, 12T, 13T, 14T, 15T, 16T, 17T, 18T, 19T, 20T
Minimum Clock Cycle Time (tCK min):	0,750 ns (1333,33 MHz)
Maximum Clock Cycle Time (tCK max):	1,600 ns (625,00 MHz)
CAS# Latency Time (tAA min):	13,750 ns
RAS# to CAS# Delay Time (tRCD min):	13,750 ns
Row Precharge Delay Time (tRP min):	13,750 ns
Active to Precharge Delay Time (tRAS min):	32,000 ns
Act to Act/Refresh Delay Time (tRC min):	45,750 ns
Normal Refresh Recovery Delay Time (tRFC1 min):	550,000 ns
2x mode Refresh Recovery Delay Time (tRFC2 min):	350,000 ns
4x mode Refresh Recovery Delay Time (tRFC4 min):	260,000 ns
Short Row Active to Row Active Delay (tRRD_S min):	5,300 ns
Long Row Active to Row Active Delay (tRRD_L min):	6,400 ns
Write Recovery Time (tWR min):	15,000 ns
Short Write to Read Command Delay (tWTR_S min):	2,500 ns
Long Write to Read Command Delay (tWTR_L min):	7,500 ns
Long CAS to CAS Delay Time (tCCD_L min):	5,000 ns
Four Active Windows Delay (tFAW min):	30,000 ns
Maximum Active Window (tMAW):	8192*tREFI
Maximum Activate Count (MAC):	Unlimited MAC
DRAM VDD 1,20 V operable/endurant:	Yes/Yes

Thermal Parameters

Module Thermal Sensor:

Not Incorporated

SPD Protocol

SPD Revision:	1.1
SPD Bytes Total:	512
SPD Bytes Used:	384
SPD Checksum (Bytes 00h-7Dh):	D753h (Error)
SPD Checksum (Bytes 80h-FDh):	1733h (Error)

Part number details

JEDEC DIMM Label:

8GB 1Rx16 PC4-2666V-UC0-11

Frequency	CAS	RCD	RP	RAS	RC	RRDS	RRDL	WR	WTRS	WTRL	FAW
1333 MHz	20	19	19	43	61	8	9	20	4	10	40
1333 MHz	19	19	19	43	61	8	9	20	4	10	40
1200 MHz	18	17	17	39	55	7	8	18	3	9	36
1200 MHz	17	17	17	39	55	7	8	18	3	9	36
1067 MHz	16	15	15	35	49	6	7	16	3	8	32
1067 MHz	15	15	15	35	49	6	7	16	3	8	32
933 MHz	14	13	13	30	43	5	6	14	3	7	28
933 MHz	13	13	13	30	43	5	6	14	3	7	28
800 MHz	12	11	11	26	37	5	6	12	2	6	24
800 MHz	11	11	11	26	37	5	6	12	2	6	24
667 MHz	10	10	10	22	31	4	5	10	2	5	20

Intel Extreme Memory Profiles

XMP Parameter	Profile 1	Profile 2
Profiles Revision: 2.0
Profile 1 (Certified) Enables: Yes
Profile 2 (Extreme) Enables: No
Profile 1 Channel Config: 2 DIMM/channel
Speed Grade:	DDR4-3200	N/A
DRAM Clock Frequency:	1600 MHz	N/A
Module VDD Voltage Level:	1,35 V	N/A
Minimum DRAM Cycle Time (tCK):	0,625 ns	N/A
CAS Latencies Supported:	22T,21T,20T,19T, 18T,17T,16T,15T, 14T,13T,12T,11T, 10T	N/A
CAS Latency Time (tAA):	16T	N/A
RAS# to CAS# Delay Time (tRCD):	20T	N/A
Row Precharge Delay Time (tRP):	20T	N/A
Active to Precharge Delay Time (tRAS):	38T	N/A
Active to Active/Refresh Delay Time (tRC):	58T	N/A
Four Activate Window Delay Time (tFAW):	48T	N/A
Short Activate to Activate Delay Time (tRRD_S):	9T	N/A
Long Activate to Activate Delay Time (tRRD_L):	11T	N/A
Normal Refresh Recovery Delay Time (tRFC1):	880T	N/A
2x mode Refresh Recovery Delay Time (tRFC2):	560T	N/A
4x mode Refresh Recovery Delay Time (tRFC4):	416T	N/A

 

[Mustafa Pelin]

dostum windowsa gelip windows bellek tanımlama yaz sorunun belleklerde olup olmadığını öğren ona göre yardım almaya çalış